Rail Applications – Distributed Acoustic Sensing System
“In this project we reduced the form factor from a 4U dual xeon system to a smaller 2U platform to meet depth restraints and compliance issues, whilst being able to house the future expansion requirements demanded by the application. ”
Mark Aveson, Sales Manager
This project is to support the computer processing requirements for a rail application involving distributed temperature sensing, acoustic sensing, and vibration sensing.
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Enquiring about: Rail Applications – Distributed Acoustic Sensing System
The Challenges:
2U short depth chassis
Customer branding (chassis colour & logo) to fitting with
customer manufactured instrumentation.
Thermal footprint 50°C
Expansion for 3 full length – 3rd party card in a small footprint
rack PC – digitiser card, GPS & GPU cards
