ECX-1300 PEG compact, fanless embedded computers are specified with a wide operating temperature range and offer extreme performance through Intel’s latest generation Core i and Xeon processors dual slot PCI/PCIe x16 expansion, multiple USB 3.1 and flexible I/O features make these models ideal for wide range of applications.
Industry-leading performance with Intel’s Xeon and Core i technology. The ECX-1300 features options for high performance (up to 4.6GHz) multi-core processors designed for demanding vision and imaging applications.
Dual slot PCIe slot for up to 250w Nvidia or AMD graphics card for image intensive or AI computing applications.
The ECX-1300 features dual hot swap 2.5-inch HDD/SSD bays with support for RAID 0/1 to enhance system performance and availability.
Extensive connectivity options allow the ECX-1300 series to be configured with up to 6 x 1GBit Ethernet Ports.
| CPU | 8 Cores Intel® Xeon®/Core™ i7/i5/i3 Processor (CFL-R S) |
| Memory | 2 DDR4 2666MHz SO-DIMM, up to 64GB (ECC/Non-ECC) |
| Storage | SATA: 4 SATA III (6Gbps) support S/W RAID 0, 1, 5, 10 |
| Graphics | Graphics Processor |
| Expansion | PCIe x 16 (Dual Width) for up to 250W Nvidia or AMD Graphics |
| Optional | TPM: Optional Infineon SLB9665 supports TPM 2.0, LPC interface |
| LAN | LAN 1 Intel® I219LM GigE LAN supports iAMT 12.0 |
| I/O | Serial: 4 COM RS-232/422/485 (ESD 8KV) |
| Video/Audio | Audio Codec: Realtek ALC888S, 7.1 Channel HD Audio |
| Operating system | Windows 10, Linux |
| Input voltage | -12V to 36V for PEG card TDP less than 130W |
| Dimensions | 260mm x 215mm x 104.1mm (10.24″ x 8.46″ x 4.10″) |
| Shock | – IEC 61373 : 2010 |
| Operating Temperature | -20°C to 45°C (-4°F to 113°F) |
